Alabama A&M University is a key partner in the HBCU CHIPS Network, a $2 million initiative funded by the National Science Foundation (NSF). Spearheaded by Clark Atlanta University, this collaborative effort unites Historically Black Colleges and Universities (HBCUs), government agencies, industry leaders, and academic institutions to establish a national resource for semiconductor research and education.
As part of the initiative, Alabama A&M will receive $200,000 to focus on the development of thermoelectric materials and integrated power/cooling devices. Partners Delaware State University will work on optimizing 2D-3D material integration. Jackson State University and North Carolina A&T State University will develop 2D semiconductor devices and optoelectronics. Norfolk State University will develop semiconductor packaging using polymer and boron nitride composites. Georgia Institute of Technology will improve chip-to-system packaging.
“Alabama A&M joined the CHIPS Consortium led by Georgia Tech in 2023 under the leadership of Vice President of Research & Economic Development Dr. Majed El-Dweik,” said Dr. Satilmis Budak, Professor in the Department of Electrical Engineering and Computer Science. “The team started to meet weekly to form proposals for CHIPS-Act research and workforce development. Since then, our team has actively collaborated to secure funding, improve facilities, and create opportunities for workforce development.”
The two-year project involves a multi-institutional approach to tackling key challenges in semiconductor technology. Budak and Electrical Engineering and Computer Science Professor Dr. Zhigang Xiao are leading the Alabama A&M team, which includes four students who have already begun working on research initiatives.
The HBCU CHIPS Network aims to cultivate a diverse and skilled workforce to support the national semiconductor industry. The student research, internships, and specialized curriculum development in semiconductor design, fabrication, and related fields will expand the microelectronics workforce.
Key goals of the initiative include:
· Establishing administrative infrastructure to integrate HBCUs into national semiconductor research networks.
· Developing an integrated microelectronic system to address challenges in design, packaging, and reliability.
· Launching an electronic database to connect students with internships and experiential learning opportunities in the semiconductor field.
“This is a transformative moment for semiconductor research in the U.S.,” adds Budak. “The impact on our students and the broader U.S. semiconductor landscape will be profound. This partnership ensures that our students will be at the forefront of innovation, now and in the future.”
